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Bach 1.0 – Underfill Removal Blade
CA$6.69
13
Items sold in last 3 minutes
| Quantity | Price | Discount |
|---|---|---|
| 20-50 | CA$6.49 | 3% |
| 51-200 | CA$6.36 | 5% |
| 201+ | CA$6.22 | 7% |
Estimated delivery dates: July 9, 2025 – July 12, 2025
For urgent delivery, please contact us
Description
MACH BLADE SERIES – MA1.0 UNDERFILL REMOVAL BLADE
- This blade helps you removing underfill from the logic board around IC Chips to help the microsoldering process.
- 2mm blade easily copes with a variety of small size ic.
- 1. Heated by hot air gun,
- 2. Cut the side edge of the blade and take it out.
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